Smart, Stable Chip-level Cooling for AI/HPC Server Processor

ANENOVA-ECM

  • E-cooling module
  • Compact
  • Fully secured
  • AI Solutions
Smart, stable chip-level cooling prototype for AI/HPC Server Processors. We re-engineer the thermal transfer paradigm to deliver absolute reliability without the liquid risk.
We overcome the biggest challange of chip's performance

Electronic thermal crisis

Chip thermal density outpaces cooling capability

  • 68% GPU tasks are affected by throttling due to lagging cooling
  • Uneven temperature causes high chip failure rate
  • Cooling systems require high energy consumption to maintain performance
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